Low-pressure molding as a method of enclosing consumer electronics

Low-pressure molding is a relatively new process (to North Americans) that aims to encapsulate sensitive electronics using a polyamide material. The process was discovered in Germany in the 70’s as a result of the observed effectiveness of using hot melt glue (a polyamide) to strain relieve electrical connections on printed circuit boards (PCBs).

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Design of Secure Tab E 9.6 Enclosure for Smart Cabinets Inc (SCI)

The original reason this project came through our doors was that SCI wanted to extend the life of the batteries in the tablets that are at the heart of their AED training kiosks. They asked Samsung for a solution and were referred to Lava and our battery modulation technology. It was then found that their product itself was quite flawed and I was tasked with redesigning it.

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